Ceramic Substrates & Packaging
DPC, DBC, AMB, HTCC/LTCC substrates, thin/thick film circuits, ceramic packages, heat sinks
Exhibition Scope
Ceramic Circuit Substrates
DPC, DBC, AMB, HTCC/LTCC substrates, thin/thick film circuits
Ceramic Packages
Ceramic packages & bases, heat sinks, BeO/AlN/mullite substrates
Featured Exhibitors
Shengda Electronics
C01
Featured
Esina New Materials
C05
Featured
Taoxinke Semiconductor
C09
Featured
Zecheng Technology
C13
Featured
Yanjiu Technology
C17
Zhengtian Materials
C21
* Partial list, in no particular order
Book Your Booth Now
Limited booths available, first come first served