Exhibition Highlights
The 7th Precision Ceramics Industry Chain Exhibition was successfully held at the Shenzhen World Exhibition & Convention Center. It covered ~18,000 sqm, gathered 450+ exhibitors and attracted 45,000 professional visitors across the full ceramics and power semiconductor packaging chain.
The expo focused on ceramic devices & materials, structural ceramics, substrates & packaging, metal materials & pastes, power semiconductor packaging, processing equipment, testing and consumables, with 8 concurrent forums on semiconductor ceramics, MLCC, LTCC/HTCC, ceramic substrates and power semiconductors.
Zone Highlights
Ceramic Devices & Materials
MLCC, LTCC, HTCC, microwave dielectric & piezoelectric ceramics, BaTiO3, alumina/zirconia, AlN powder, green tape
Precision Structural Ceramics
Zirconia, alumina, AlN, Si3N4, SiC, ceramic bearings, semiconductor ceramics (ESC, etching rings), 3D-printed & bio ceramics
Ceramic Substrates & Packaging
DPC, DBC, AMB, HTCC/LTCC substrates, thin/thick film circuits, ceramic packages, heat sinks
Metal Materials & Electronic Pastes
Silver/copper/nickel powder, electrode & LTCC pastes, W-Mo paste, targets, OFC strip, Kovar alloy
Power Semiconductor Packaging
SiC, DBC/AMB substrates, packages, bonding wire, AlSiC heat sinks, thermal gel, solder preforms, Cu terminals
Ceramic Processing Equipment
Sand/ball mills, tape casters, isostatic presses, screen printers, lamination, debinding & sintering furnaces, laser drilling
Packaging & Testing Equipment
Die bonders, wire bonders, sealing/seam welding, X-ray, He leak test, SAM, AOI, test & sorting
Additives & Consumables
Dispersants, binders, plasticizers, sintering aids, release film, carrier tape, setters/saggars, abrasives